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Home » NEWEST Products » New by Manufacturer » TDK » TDK C Series Conductive Epoxy Automotive-Rated MLCCs
NEWEST Products
TDK C Series Conductive Epoxy Automotive-Rated MLCCs

TDK C Series Conductive Epoxy
Automotive-Rated MLCCs

TDK's Conductive Epoxy C Series consists of MLCCs that are conductive glue-mounted rather than solder-mounted.  The C Series Conductive Epoxy MLCCs from TDK are critical in high temperature environments that require high reliability, such as automotive applications.  These AEC-Q200 automotive-rated conductive glue-mounted devices allow for more flexibility during periods of expansion and contraction because thermal expansion differences between the substrate, MLCC, and solder fillet have been reduced by using a non-solder attachment.  TDK's Conductive Epoxy MLCCs are also used in applications that cannot be subjected to the heat of the solder paste mounting process, such as LCD panels, organic EL and LED displays, and CCD devices, which are especially sensitive to high temperatures. 

NEW! TDK has added additional MLCCs to the C Series Conductive Epoxy automotive-rated product line.

FEATURES
  • AgPdCu termination for conductive glue mounting
  • Reduced risk of silver migration
  • Improved mechanical/thermal strength when used with conductive glue
  • AEC-Q200 compliant
  • RoHS, WEE, and REACH compliant
APPLICATIONS
  • Transmission control
  • Engine sensor module
  • Automotive power train
  • Anti-Lock Breaking System
  • Application requiring conductive glue mounting method
  • TDK
  • Passive Components|Capacitors